| Autor: |
Meng-Hsian Chou, Gou-Jen Wang |
| Rok vydání: |
2001 |
| Předmět: |
|
| Zdroj: |
Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products. |
| DOI: |
10.1115/imece2001/epp-24716 |
| Popis: |
Besides the major factors such as the down force, back pressure and the rotating speed of wafer carrier, effect of polishing time is also an important issue in CMP processes. In this study, a neural-Taguchi method based cost-effectively quasi time-optimal technique for Chemical-Mechanical Polishing. (CMP) processes is developed. Key concept of this new technique is that an optimal processes parameter set is obtained through a neural networks simulated CMP processes model. Under such an optimal parameters set, the desired material removal rate (MRR) and within-wafer-nonuniformity (WIWNU) can be reached with the optimal polishing time. It has been proved by experiments that the proposed method can offer a better polishing performance while reducing the polishing time by 1/3. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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