Application of TOFSIMS for Contamination Issues in the Assembly World
| Autor: | Zhiyong Wang, R. Tanikella, A. Proctor, Balu Pathangey, Zezhong Fu |
|---|---|
| Rok vydání: | 2007 |
| Předmět: |
Computer science
Process (engineering) Delamination Time of flight secondary ion mass spectroscopy Contamination Electronic Optical and Magnetic Materials Reliability engineering Secondary Ion Mass Spectroscopy Premature failure Reliability (semiconductor) Chip-scale package Forensic engineering Electrical and Electronic Engineering Safety Risk Reliability and Quality |
| Zdroj: | IEEE Transactions on Device and Materials Reliability. 7:11-18 |
| ISSN: | 1530-4388 |
| DOI: | 10.1109/tdmr.2007.900057 |
| Popis: | Within the assembly world, problems related to package contamination, which stem from material sourcing and assembly process excursions, can impact product reliability. From the reliability perspective, it is essential to achieve integrity at all internal interfaces in the flip-chip, wire-bond, and novel mixed technology packages. In many instances, both organic and low-level ionic contaminants have resulted in interface delamination, metal migration, microcracking, etc., which leads to a premature failure of products either in reliability tests or in the field. Several examples of failure analysis relating to package contamination in the assembly world and the effectiveness of time-of-flight secondary ion mass spectroscopy in isolating and understanding failures are highlighted in this paper. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|