Next Generation Chip Embedding Technology for High Efficiency Power Modules and Power SiPs
| Autor: | Vikas Gupta, Kay Essig, C.T. Chiu, Mark Gerber |
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| Rok vydání: | 2021 |
| Zdroj: | Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces. :169-192 |
| DOI: | 10.1002/9781119793908.ch7 |
| Databáze: | OpenAIRE |
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