Constructing 3D package component broadband electrical models with correct DC values

Autor: Jinwoo Choi, J.D. Morsey, Barry J. Rubin, Wiren D. Becker, Zhaoqing Chen
Rok vydání: 2010
Předmět:
Zdroj: 19th Topical Meeting on Electrical Performance of Electronic Packaging and Systems.
DOI: 10.1109/epeps.2010.5642594
Popis: Accurate channel simulations of package interconnections require passive and causal models that faithfully represent the full frequency response from tens of gigahertz to DC. In this paper, we propose and test a method to create accurate models extending to DC while retaining passivity and causality. The model derived by this method is suitable for transient simulations of packaging interconnect systems.
Databáze: OpenAIRE