| Autor: |
Byung Sup Rho, Dong Su Kim, Byoung Ho Rhee, Hyo-Hoon Park, Sang Won Ha, Kyoung Up Shin, Sun Tae Jung, Sae-Kyoung Kang, Taeil Kim, Han Seo Cho |
| Rok vydání: |
2004 |
| Předmět: |
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| Zdroj: |
Optical Engineering. 43:3083 |
| ISSN: |
0091-3286 |
| DOI: |
10.1117/1.1810530 |
| Popis: |
A simple method for fabricating fiber-embedded boards using a grooving technique is described that is quite cost effective and fully compatible with conventional printed circuit board (PCB) processes with no necessity for a specially designed wiring machine. FR-4 plates are grooved using a dicing saw machine and followed by placing optical fibers into the grooves. The fiber-embedded PCBs are laminated by conventional PCB processes at a temperature of 180°C for 1 h under 47 kg/cm 2 of pressure. The 50/125-µm glass fibers, and the polyimide-coated glass fibers are laminated successfully. In the fiber-embedded boards with a length of 10 cm, the variation of center positions of the embedded glass fibers is about ±5 µm. The transmitted optical power through the fiber-embedded boards shows a good uniformity of less than ±0.5 dB variation from the average value for the 12 fiber channels. Data transmission through the board at data rates of 2.5 Gbits/s is achieved. After confirming the successful laminations and the data transmission with the small-scale fiber-embedded boards, a large-scale prototype of the fiber-embedded board for a backplane application is successfully fabricated. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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