Combining Fine Line Photoimageable with Multi-Step Thick Film for Improved Circuit Density
| Autor: | Roland Tacken, Jasper Nab, Daniel Mitcan |
|---|---|
| Rok vydání: | 2017 |
| Předmět: |
010302 applied physics
Interconnection Materials science Computer Networks and Communications business.industry 02 engineering and technology 021001 nanoscience & nanotechnology 01 natural sciences Line (electrical engineering) Electronic Optical and Magnetic Materials visual_art 0103 physical sciences Electronic component Electronic engineering visual_art.visual_art_medium Miniaturization Thick film technology Microelectronics Optoelectronics Ceramic Electrical and Electronic Engineering Routing (electronic design automation) 0210 nano-technology business |
| Zdroj: | Journal of Microelectronics and Electronic Packaging. 14:94-99 |
| ISSN: | 1551-4897 |
| DOI: | 10.4071/imaps.459344 |
| Popis: | There is a strong market need for further miniaturization of microelectronic ceramic-based products; electronic components require an increasingly finer pitch interconnect. Screen-printing resolution is a limiting factor in further miniaturization of classical thick film. Photo imageable thick film technology (PITF) was proposed decades ago as a successor technology to thick film, to achieve finer pitch patterns. However, where classical multilayer thick film provides good routing and interconnect capabilities, but insufficient fine line resolution, PITF does the reverse: no multilayer routing but advanced fine line performance. A combination of PITF for fine pitch mounting with advanced MLTF for efficient routing has been developed, targeting a linewidth of 50 μm line/spaces and below. Test and demo panels were made, using combinations of PITF pastes and conventional screen-print materials. Results, process performance, and limiting factors are discussed. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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