A Ceramic Capacitor Substrate for High Speed Switching VLSI Chips
| Autor: | Chung-Wen Ho, C. Bajorek, M. Sampogna, Dudley Augustus Chance |
|---|---|
| Rok vydání: | 1982 |
| Předmět: |
Very-large-scale integration
Fabrication Materials science business.industry General Engineering Electrical engineering Industrial and Manufacturing Engineering Electronic Optical and Magnetic Materials law.invention Capacitor Substrate (building) law visual_art Hardware_INTEGRATEDCIRCUITS Electronic engineering visual_art.visual_art_medium Ceramic Electrical and Electronic Engineering Thin film Ceramic capacitor business Realization (systems) |
| Zdroj: | IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 5:368-374 |
| ISSN: | 0148-6411 |
| DOI: | 10.1109/tchmt.1982.1136005 |
| Popis: | An integrated capacitor substrate which is proposed as an essential part in the realization of a thin film module for high speed digital computing systems is discussed. Several innovative multilayer ceramic (MLC) concepts relative to the fabrication of the desired low inductance capacitor and current paths to chips are described. Ceramic and metal composite material sets which may be used in the fabrication are also proposed. Experimental evaluations of some of the crucial concepts were made and included in the discussions. The result is an elegant approach to the fabrication of one of the key requirements in realizing the thin film high performance module. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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