Fabrication of a 2.5Gbps×4 channel optical micro-module for O-PCB application
| Autor: | Hyun-Shik Lee, Jin-Ku Kang, Do-Kyoon Kim, Young Wan Choi, Young Hyo Kim, Beom Hoan O, El-Hang Lee, Seung Gol Lee, Shinmo An |
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| Rok vydání: | 2006 |
| Předmět: |
Coupling
Fabrication Materials science business.industry Physics::Optics Radiation angle Condensed Matter Physics Laser Waveguide (optics) Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials Vertical-cavity surface-emitting laser law.invention Photodiode Printed circuit board Optics law Electrical and Electronic Engineering business |
| Zdroj: | Microelectronic Engineering. 83:1347-1351 |
| ISSN: | 0167-9317 |
| DOI: | 10.1016/j.mee.2006.01.118 |
| Popis: | We report on the fabrication of a polymer-based 2.5Gbpsx4 channel optical interconnecting micro-module for optical printed circuit board (O-PCB) application. An optical waveguide array is used for optical transmission from vertical surface emitting laser (VCSEL) array to photodiode (PD) array and the built-in 45^o waveguide mirrors are used for vertical coupling. The optical waveguide array and the 45^o mirrors are fabricated by UV imprint process in one-step. We fabricate microlensed VCSELs by micro-inkjetting method, which reduced radiation angle of VCSEL from 18^o to 15^o for better light coupling. We use solder ball array and pin array for alignment between O-PCB and the electrical sub-boards with alignment mismatch below [email protected] in x, y and z axis. The fabricated optical interconnection module transmits data at the rate of 2.5Gbps per channel. |
| Databáze: | OpenAIRE |
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