Correlating Removal Rate to Directivity in Copper Chemical Mechanical Planarization

Autor:	Heeill Kwon, Dongyoul Park, Ara Philipossian, Hossein Dadashazar, Yasa Sampurno, Yongbin Lee, Sung Gyu Kim, Jeffrey McAllister
Rok vydání:	2019
Předmět:	Materials science chemistry Chemical-mechanical planarization chemistry.chemical_element Composite material Directivity Copper Electronic Optical and Magnetic Materials
Zdroj:	ECS Journal of Solid State Science and Technology. 8:P734-P739
ISSN:	2162-8777 2162-8769
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::57df7e950aaec62f4e3a852af739af93 https://doi.org/10.1149/2.0201911jss Zobrazit plný text záznamu