Progress Review of Electromagnetic Compatibility Analysis Technologies for Packages, Printed Circuit Boards, and Novel Interconnects
| Autor: | Xing-Chang Wei, Andreas C. Cangellaris, En-Xiao Liu, Marcello D'Amore, Joungho Kim, Yaojiang Zhang, Toshio Sudo, Er-Ping Li |
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| Rok vydání: | 2010 |
| Předmět: |
Engineering
business.industry Electronic packaging Electrical engineering Electromagnetic compatibility Power integrity Integrated circuit design Integrated circuit Condensed Matter Physics Atomic and Molecular Physics and Optics law.invention Printed circuit board law visual_art Electronic component Hardware_INTEGRATEDCIRCUITS visual_art.visual_art_medium Electronic engineering Signal integrity Electrical and Electronic Engineering business |
| Zdroj: | IEEE Transactions on Electromagnetic Compatibility. 52:248-265 |
| ISSN: | 1558-187X 0018-9375 |
| DOI: | 10.1109/temc.2010.2048755 |
| Popis: | The ever-increasing demands of digital computing and wireless communication have been driving the semiconductor technology to change with each passing day. Modern electronic systems integrate more complex components and devices, which results in a very complex electromagnetic (EM) field environment. EM compatibility has become one of the major issues in ICs redesign, mainly due to the lack of efficient and accurate simulation tools and expertise on noise reduction and immunity improvement. This paper reviews the state of the arts of IC, electronic package, and printed circuit board simulation and modeling technologies. It summarizes the modeling technologies for both available structures [multilayered power-ground planes and macromodeling of interconnect (INC)] and novel structures (nano-INCs and 3-D ICs based on through-silicon via technology). It also illustrates the trends of simulation and modeling technologies in EM compatibility, signal integrity, and power integrity. |
| Databáze: | OpenAIRE |
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