Direct Laser Patterned Electroplated Copper Contacts for Interdigitated Back Contact Silicon Solar Cells
| Autor: | Kevin D. Dobson, Ugochukwu Nsofor, Zeming Sun, Mool C. Gupta, Steven Hegedus, Arpan Sinha, Ujjwal Das |
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| Rok vydání: | 2019 |
| Předmět: |
Resistive touchscreen
Materials science Silicon business.industry 020209 energy Nucleation chemistry.chemical_element 02 engineering and technology Substrate (electronics) 021001 nanoscience & nanotechnology Laser Copper law.invention chemistry Etching (microfabrication) law 0202 electrical engineering electronic engineering information engineering Optoelectronics 0210 nano-technology business Electroplating |
| Zdroj: | 2019 IEEE 46th Photovoltaic Specialists Conference (PVSC). |
| DOI: | 10.1109/pvsc40753.2019.8981365 |
| Popis: | Laser patterning of seed layers for Cu electroplated interdigitated contacts on Ni/a-SiN x :H/Si substrates is presented. Damage was controlled by varying the laser conditions. Cu growths shorted the contacts due to conductive residues in the scribe lines, but were attenuated with pre-deposition etching yielding electrically-isolated plated fingers. Parasitically-plated Cu stripes were now observed in laser cuts, postulated due to Cu nucleation from high current densities at pinholes originating from laser and etch damage to the resistive a-SiN x :H. While a promising approach for contact processing, laser conditions must be carefully optimized to minimize substrate damage. |
| Databáze: | OpenAIRE |
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