| Popis: |
Improved photoresist adhesion has been obtained for several halogen, amine, or alkoxy substituted organosilanes under both wet etching induced “undercutting” and simple wet development resist “lifting” conditions. The increased adhesion is attributed to the change in chemical nature of the substrate created by the chemical reaction between the organosilanes and the surface silanols of the substrate. Adhesion enhancement is found to depend upon the substrate condition, silane promoter and spinning solvent, silane cure temperature, and the photoresist employed. |
