Weak Die Screening by Feature Prioritized Random Forest for Improving Semiconductor Quality and Reliability

Autor:	Shian-Yu Lin, Pai-Yu Tan, Cheng-Wen Wu, Ming-Der Shieh, Chien-Hui Chuang, Gordon Liao
Rok vydání:	2022
Zdroj:	2022 IEEE International Test Conference in Asia (ITC-Asia).
DOI:	10.1109/itcasia55616.2022.00015
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::566c103867b9a4a608a5f359d4fbff80 https://doi.org/10.1109/itcasia55616.2022.00015 Zobrazit plný text záznamu