Light enhanced direct Cu bonding for advanced electronic assembly
| Autor: | Jenn-Ming Song, David Tarng, Sin-Yong Liang, Ying-Ta Chiu, Chih-Pin Hung, Shang-Kun Huang |
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| Rok vydání: | 2018 |
| Předmět: |
010302 applied physics
Surface science Materials science chemistry.chemical_element 02 engineering and technology Direct bonding 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences Electromagnetic radiation Atomic and Molecular Physics and Optics Electronic Optical and Magnetic Materials Xenon chemistry 0103 physical sciences Surface modification Irradiation Electrical and Electronic Engineering Diffusion (business) Composite material 0210 nano-technology Joint (geology) |
| Zdroj: | Journal of Materials Science: Materials in Electronics. 29:14144-14150 |
| ISSN: | 1573-482X 0957-4522 |
| Popis: | An innovative and efficient surface modification pre-treatment that enhances Cu–Cu direct bonding through electromagnetic irradiation, including pulsed Xenon flash and near infrared rays is proposed. Without vacuum, short but critical electromagnetic radiation exposure on faying faces prior to bonding can significantly improve the joint strength up to 50% or even more. Copper atom diffusion acceleration by increased compressive residual surface stresses resulting from sudden heating/cooling accounts for the joint reinforcement. A close relationship between the increase in joint strength and the change in surface physics properties due to electromagnetic irradiations can be found. |
| Databáze: | OpenAIRE |
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