Effectiveness of Slow Cure Non-Conductive Film in Void elimination

Autor:	Li Jao, Ming Hung Lai, Sareddy Kr, Meng Hung Tsai, Angelo Espina, Min Hua Chung, Chong Leong Gan
Rok vydání:	2022
Zdroj:	2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
DOI:	10.1109/eptc56328.2022.10013292
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::55e8d27b5c7c46cbdc9adceaba5e45e0 https://doi.org/10.1109/eptc56328.2022.10013292 Zobrazit plný text záznamu