Integration of 5G and OPC UA for Smart Manufacturing of the Future

Autor:	Xiongfeng Zhang, Seonjo Lim, Changdae Lee, Won Seok Song, Yu Chul Kim, Mengmeng Yu, Seung Ho Hong, Nam Hyun Yoo, Min Wei
Rok vydání:	2023
Zdroj:	2023 IEEE/SICE International Symposium on System Integration (SII).
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::55e7788f4e619667707d2d13f2569c5c https://doi.org/10.1109/sii55687.2023.10039191 Zobrazit plný text záznamu