Integration of 5G and OPC UA for Smart Manufacturing of the Future
Autor: | Xiongfeng Zhang, Seonjo Lim, Changdae Lee, Won Seok Song, Yu Chul Kim, Mengmeng Yu, Seung Ho Hong, Nam Hyun Yoo, Min Wei |
---|---|
Rok vydání: | 2023 |
Zdroj: | 2023 IEEE/SICE International Symposium on System Integration (SII). |
Databáze: | OpenAIRE |
Externí odkaz: |