Packaging and Characterization of an Ultra Compact 1200V PCB SiC MOSFET Half-Bridge Module
| Autor: | Wei-Jung Hsu, Junhong Tong, Qingyun Huang, Alex Q. Huang |
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| Rok vydání: | 2023 |
| Zdroj: | 2023 IEEE Applied Power Electronics Conference and Exposition (APEC). |
| Databáze: | OpenAIRE |
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