Study on Slurry of Chemical Mechanical Polishing 304 Stainless Steel Based on Ferric Chloride and Oxalic Acid
| Autor: | Hong Quan Qin, Jia Peng Chen, Qing Li, Jian Xiu Su |
|---|---|
| Rok vydání: | 2016 |
| Předmět: |
Materials science
Mechanical Engineering Oxalic acid Metallurgy Substrate (chemistry) Condensed Matter Physics Chloride chemistry.chemical_compound chemistry Mechanics of Materials Chemical-mechanical planarization Oxidizing agent medicine Surface roughness Slurry Ferric General Materials Science medicine.drug |
| Zdroj: | Materials Science Forum. 861:102-107 |
| ISSN: | 1662-9752 |
| DOI: | 10.4028/www.scientific.net/msf.861.102 |
| Popis: | Stainless steel will become one of the substrate materials used in flexible display. In this paper, the influence of the ferric chloride and the oxalic acid on the material removal rate (MRR) and surface roughness had been studied in the chemical mechanical polishing (CMP) 304 stainless steel. By analysis and research, the slurry ingredients based on the type of ferric chloride and oxalic acid had been obtained. The experimental results show that, the material removal rate reached more than 200nm/min. By the qualitative analysis on the phases of the surface material of 304 stainless steel using X-ray diffraction (XRD) after CMP, it is proved that the ferric chloride based slurry did not change the original phases and did not affect the performance of 304 stainless steel. The research results of this paper can provide the reference for the study the CMP slurry of 304 stainless steel. |
| Databáze: | OpenAIRE |
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