Optimization of die bond process parameters of MEMS thermopile chip

Autor:	孙立宁 Sun Li-ning, 王敏锐 Wang Min-rui, 陈立国 Chen Li-guo, 倪灯塔 Ni Deng-ta, 姜勇涛 Jiang Yong-tao
Rok vydání:	2019
Předmět:	Microelectromechanical systems Materials science business.industry Bond Process (computing) Optoelectronics business Chip Thermopile Atomic and Molecular Physics and Optics Die (integrated circuit) Electronic Optical and Magnetic Materials
Zdroj:	Optics and Precision Engineering. 27:137-145
ISSN:	1004-924X
DOI:	10.3788/ope.20192701.0137
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::553e59799441c69bb60b0bff056711ce https://doi.org/10.3788/ope.20192701.0137 Zobrazit plný text záznamu