Cutting mechanism and performance of high-speed machining of a titanium alloy using a super-hard textured tool
| Autor: | Xiangqiang Zhong, Liang Li, Su Yongsheng, Gang Wang |
|---|---|
| Rok vydání: | 2018 |
| Předmět: |
0209 industrial biotechnology
Materials science 020502 materials Strategy and Management Rake Alloy 02 engineering and technology Adhesion Management Science and Operations Research Edge (geometry) engineering.material Industrial and Manufacturing Engineering 020901 industrial engineering & automation 0205 materials engineering Machining Lubrication engineering Composite material Contact area Layer (electronics) |
| Zdroj: | Journal of Manufacturing Processes. 34:706-712 |
| ISSN: | 1526-6125 |
| DOI: | 10.1016/j.jmapro.2018.07.004 |
| Popis: | The study investigates the anti-friction and anti-adhesion effects of micro-textured super-hard polycrystalline diamond (PCD) tools in high-speed machining of a titanium alloy, Ti6Al4V. The experimental results indicate that the friction coefficient can be dramatically reduced by increasing the cutting speed. PCD tools with micro-grooves resulted in less friction during cutting in the absence of lubrication than both un-textured and textured tools with various lubrication condition. It was found that the adhesion area on the rake face of the PCD tool during high-speed cutting can be dramatically reduced by adding micro-grooves near the main cutting edge. It was shown that the maximum width of chip adhesion was reduced by 23.6% on the micro-grooved tool compared to that on the un-textured tool. Furthermore, the results confirmed that TiC can be formed on the surfaces of PCD tools as a bonding layer, which is of significance to revealing anti-friction performance of tool-chip interface. Together, these results show that the directional distribution of the micro-grooves on the tool, the actual tool–chip contact area, the effect of micro-grooves on trapping tiny debris and the TiC bonding layer play important roles in improving tool performance. |
| Databáze: | OpenAIRE |
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