Mini LED array transferred onto a flexible substrate using Simultaneous Transfer and Bonding (SITRAB) process and Anisotropic Solder Film (ASF)

Autor:	Jiho Joo, Gwang-Mun Choi, Chanmi Lee, Yong-Sung Eom, In-Seok Kye, Ki-Seok Jang, Seok Tae Hwang, Jeong Duck Kim, Kwang-Seong Choi
Rok vydání:	2022
Zdroj:	2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::543a6748176a5a9c053e0ab68924a508 https://doi.org/10.1109/ectc51906.2022.00104 Zobrazit plný text záznamu