Partial Underfill Impact Study on Solder Joint Reliability in Smartphone Application
Autor: | Ling Pan, Fa Xing Che, Yeow Chon Ong, Hong Wan Ng, Koustav Sinha, Wren Chen |
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Rok vydání: | 2022 |
Zdroj: | 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC). |
Databáze: | OpenAIRE |
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