Partial Underfill Impact Study on Solder Joint Reliability in Smartphone Application

Autor:	Ling Pan, Fa Xing Che, Yeow Chon Ong, Hong Wan Ng, Koustav Sinha, Wren Chen
Rok vydání:	2022
Zdroj:	2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::5412a8eab557efc125a684d36dfe148a https://doi.org/10.1109/eptc56328.2022.10013204 Zobrazit plný text záznamu