Piezoresistive bond lines for timber construction monitoring—experimental scale-up
| Autor: | Stefan Haase, Ulrich Schwarz, Markus Jahreis, Christoph Winkler |
|---|---|
| Rok vydání: | 2021 |
| Předmět: |
chemistry.chemical_classification
Digital image correlation Materials science Critical load Forestry 02 engineering and technology Plant Science Polymer 010402 general chemistry 021001 nanoscience & nanotechnology 01 natural sciences Piezoresistive effect Industrial and Manufacturing Engineering Electrical contacts 0104 chemical sciences Electrical resistance and conductance chemistry General Materials Science Adhesive Composite material 0210 nano-technology GLUE |
| Zdroj: | Wood Science and Technology. 55:1379-1400 |
| ISSN: | 1432-5225 0043-7719 |
| Popis: | Several laboratory studies and experiments have demonstrated the usability of polymer films filled with electrically conductive filler as piezoresistive material. Applied to adhesives, the glue lines of wood products can achieve multifunctional—thus bonding and piezoresistive/strain sensing—properties. Based on critical load areas in timber constructions, upscaled test setups for simplified load situations were designed, especially with regard to a stress-free electrical contact. In a second step, another upscaling was done to small glulam beams. Based on an experimental test sequence, the piezoresistive reactions as well as the behaviour until failure were analysed. The results show in all cases that a piezoresistive reaction of the multifunctionally bonded specimens was measurable, giving a difference in the extent of relative change. Additionally, measured phenomena like inverse piezoresistive reactions, electrical resistance drift and the absence of a piezoresistive reaction were discussed, based on additional strain analysis by digital image correlation. A model of macroscopic and microscopic strains influencing the piezoresistive reaction of the electrically conductive bond line in wood was used to explain all experimental results. Finally, a first scale-up of piezoresistive bond lines from laboratory samples to glulam beams was possible and successful. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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