Interfacial microstructure characterization and strength evaluation of Si3N4/Si3N4 joints with Si–Mg composite filler for high-temperature applications
| Autor: | Kazuyuki Kohama |
|---|---|
| Rok vydání: | 2021 |
| Předmět: |
010302 applied physics
Materials science Process Chemistry and Technology Composite number 02 engineering and technology Liquidus engineering.material 021001 nanoscience & nanotechnology Microstructure 01 natural sciences Isothermal process Surfaces Coatings and Films Electronic Optical and Magnetic Materials Filler (materials) 0103 physical sciences Ultimate tensile strength Materials Chemistry Ceramics and Composites engineering Composite material 0210 nano-technology Layer (electronics) Joint (geology) |
| Zdroj: | Ceramics International. 47:22424-22434 |
| ISSN: | 0272-8842 |
| DOI: | 10.1016/j.ceramint.2021.04.252 |
| Popis: | Silicon-nitride (Si3N4) components were joined under vacuum at 1100 °C for 10 min using Si–Mg composite fillers with Mg contents (XMg) that ranged from 0 at.% to 59 at.%. The Si3N4/Si3N4 joints were fabricated via Si layer formation at the joint interface; the molten Si–Mg liquid was transformed into a solid Si layer after Mg-evaporation-induced isothermal solidification. The joint tensile strength at room temperature increased considerably when XMg exceeded the liquidus composition of 37 at.% because of the enhanced densification/thinning of the Si layer. In these cases, some Mg atoms reacted with Si3N4 to form a fine-grained MgSiN2-based layer, whereas relatively large (>0.1 μm) and smaller MgO precipitates ( |
| Databáze: | OpenAIRE |
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