Observation and X-ray analysis of the microstructures for a bonding material of C/C composite and copper

Autor:	N. Noda, Kiyohiro Kawamata, Brian McEnaney, Akira Kurumada, Osamu Motojima, Tatsuo Oku
Rok vydání:	1996
Předmět:	Nuclear and High Energy Physics Thermal shock Materials science Scanning electron microscope Composite number chemistry.chemical_element Microstructure Copper Crystallography Nuclear Energy and Engineering chemistry Active cooling Thermal General Materials Science Composite material X ray analysis
Zdroj:	Journal of Nuclear Materials. 240:43-50
ISSN:	0022-3115
DOI:	10.1016/s0022-3115(96)00475-8
Popis:	The purpose of this study is to examine the microstructure of a bonding material of C/C composite and copper before and after thermal shock tests. Optical and scanning electron microscopy, and energy dispersive X-ray analysis were used to study the microstructures before and after thermal shock tests. In this study, the specimen were given thermal shock without an active cooling, therefore, these tests are considered to simulate only heat load at the most severe condition as an accident. The bonding material was not fractured by the thermal shock tests, however, thermal cracks and delaminations were found in the bonding layers.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::539d8645abb73825b34c4832c09c45bc https://doi.org/10.1016/s0022-3115(96)00475-8 Zobrazit plný text záznamu Full Text from ScienceDirect