Cu RIE Interconnect Technology for Improved Energy Efficiency in IC Chips

Autor:	Nagraj S. Kulkarni, Evans, Boyd M., Nicholson, Don, Li, An-Ping, Xiaoguang Zhang, Radhakrishnan, Balasubramaniam, Kim, Tae-Hwan, Kenik, Edward A., Iii, Harry Meyer, Islam, Syed K., Mostafa, Salwa, Hess, Dennis W., Fangyu Wu, Levitin, Galit, Katayun Barmak, Coffey, Kevin, Kasica, Richard
Jazyk:	angličtina
Rok vydání:	2010
DOI:	10.13140/rg.2.2.26475.18724
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::538b6cd175a36d6e752b58e5ea5e031b Zobrazit plný text záznamu