Autor: |
Ronnie Porat, Kfir Dotan, Shirley Hemar, Lior Levin, Ken Li, George Sung, Chen-Ting Lin, Sheng-Kuo Lin, Hsin-I Wang |
Rok vydání: |
2008 |
Předmět: |
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Zdroj: |
2008 IEEE/SEMI Advanced Semiconductor Manufacturing Conference. |
Popis: |
Monitoring detectivity of the wafer edge, bevel and apex - the areas beyond the pattern - is becoming increasingly important in the yield enhancement efforts of high-end fabs. In this paper we present a methodology for root cause analysis of edge and bevel defects, based on inline SEM review and EDX-based material analysis. |
Databáze: |
OpenAIRE |
Externí odkaz: |
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