RF Performance of FOWLP to PCB Board Transition

Autor:	K. B. Zheng, Sun Mei, Sharon Lim Pei Siang, Jong Ming Chinq, Lau Boon Long, Zhou Lin, Lim Teck Guan
Rok vydání:	2022
Zdroj:	2022 IEEE 24th Electronics Packaging Technology Conference (EPTC).
DOI:	10.1109/eptc56328.2022.10013127
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::5355cdd69a12fff497122cb1d4f972c4 https://doi.org/10.1109/eptc56328.2022.10013127 Zobrazit plný text záznamu