| Autor: |
Rohini Raghunathan, Chris Carty, Kendall S. Wills, Jianbai Zhu, Philip Simon, Andy Vance, John H. Abbott, Charles P. Todd |
| Rok vydání: |
1998 |
| Předmět: |
|
| Zdroj: |
International Symposium for Testing and Failure Analysis. |
| ISSN: |
0890-1740 |
| DOI: |
10.31399/asm.cp.istfa1998p0413 |
| Popis: |
Flip Chip packaging requires an understanding of the solder bump metallurgy and its aging characteristics. In this paper we demonstrate how standard failure analysis techniques can help determine aging characteristics and, how an understanding of bump age can be successfully employed to enhance bump reliability. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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