The effect of periodic segmentation cracks on the interfacial debonding: Study on interfacial stresses
Autor: | Guang-Nan Chen, Gengxing Luo, Kun Zhang, Chen-Wu Wu, Nai-Gang Liang |
---|---|
Rok vydání: | 2006 |
Předmět: |
Décollement
Materials science Interfacial stress business.industry Surfaces and Interfaces General Chemistry Structural engineering engineering.material Condensed Matter Physics Finite element method Surfaces Coatings and Films Coating mental disorders Materials Chemistry engineering Segmentation Composite material business |
Zdroj: | Surface and Coatings Technology. 201:287-291 |
ISSN: | 0257-8972 |
DOI: | 10.1016/j.surfcoat.2005.11.115 |
Popis: | Hard coatings on relatively soft substrate always face the danger of debonding along the interface. Interfacial stresses are considered to be the initial driving force for the interfacial debonding of the relatively strong bonded coatings. Interfacial stresses due to the mismatch of strain between the coating and substrate are simulated with FEM firstly. The distribution of the interfacial stresses is achieved, which confirms an excessive stresses concentration near the interface end. Subsequently, the redistribution of interfacial stresses is calculated for a coating with periodic segmentation cracks. Results indicate that the distribution of interfacial stresses is altered greatly with the periodic segmentation cracks. To reveal the effect of the spacing of the periodic segmentation cracks on the distribution of interfacial stresses, different crack density is modeled within the coating. It is found that that the peak values of the interfacial stresses decrease with the increase of crack density, i.e. with reduction of spacing of segmentation cracks. |
Databáze: | OpenAIRE |
Externí odkaz: |