Real time contact resistance measurement to determine when microwelds start to form during ultrasonic wire bonding
| Autor: | Antti Meriläinen, Risto Kurppa, Henri Seppänen, Edward Hæggström |
|---|---|
| Rok vydání: | 2013 |
| Předmět: |
010302 applied physics
Bonding process Wire bonding Materials science Drop (liquid) Contact resistance Sem analysis Nanotechnology 02 engineering and technology Ultrasonic bonding 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials 0103 physical sciences Ultrasonic wire bonding Electrical and Electronic Engineering Composite material Linear correlation 0210 nano-technology |
| Zdroj: | Microelectronic Engineering. 104:114-119 |
| ISSN: | 0167-9317 |
| DOI: | 10.1016/j.mee.2012.12.003 |
| Popis: | We prove that we can, using contact resistance as a tool, determine the instant when the bonding process starts, i.e. microwelds start to form during ultrasonic bonding. This knowledge permits us to reduce the uncertainty in the estimated bonded area by 5-18%. We proved our claim by combining a real-time contact resistance measurement, aborted ultrasound bonding, and classical SEM analysis of the bonded surfaces. We measured and analyzed, using a 4-wire Kelvin cross setup, the contact resistance of [email protected] by diameter AlSi(1%) wires bonded to a gold pad. The microweld area of 69 bonds was determined. We focused on inferring exactly when do the microwelds start to form. Post hoc analysis showed a linear correlation between the total microweld area and the time elapsed since the initial contact resistance drop. This work may help minimizing the sonication impact which may allow working with thin bond wires and fragile substrates. |
| Databáze: | OpenAIRE |
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