Effect of temperature on electrochemical corrosion of Zn-30Sn lead-free solder
| Autor: | Jian-Chun Liu, Chuantong Chen, Gong Zhang, Katsuaki Suganuma, Zhenghong Wang, Shenbo Zeng, Zelin Yang |
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| Rok vydání: | 2018 |
| Předmět: |
010302 applied physics
Materials science Total resistance 02 engineering and technology Substrate (electronics) 021001 nanoscience & nanotechnology Microstructure Electrochemistry 01 natural sciences Electrochemical corrosion Corrosion Chemical engineering Soldering 0103 physical sciences 0210 nano-technology Layer (electronics) |
| Zdroj: | 2018 19th International Conference on Electronic Packaging Technology (ICEPT). |
| Popis: | Electrochemical measurements were employed to study the effect of temperature on the electrochemical corrosion of Zn-30Sn in neutral 0.5 M NaCl solution. The corrosion products were characterized by SEM and EDXA. OCP and potentiodynamic polarization results indicate that the increased temperature would negatively shift OCP and E corr values of Zn-30Sn, increase the i corr from 6.76 μA/cm2 to 24.97 μA/cm2, deteriorate the corrosion resistance thermodynamically and kinetically. EIS result also illustrates that increasing the temperature will decrease the total resistance value. Microstructure observations demonstrate that the surface corrosion layer with higher temperature forms a more coarse plate-like microstructure, providing less protection to the substrate. |
| Databáze: | OpenAIRE |
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