Design on UHV System with TSP

Autor: Chong Zhang, Cong Hui Li, Yun Feng Chao, Jin Hua Zheng
Rok vydání: 2013
Předmět:
Zdroj: Applied Mechanics and Materials. 310:319-322
ISSN: 1662-7482
DOI: 10.4028/www.scientific.net/amm.310.319
Popis: A UHV(ultra-high vacuum) system, which used as deposition equipment with the assistance of high and low vacuum measuring instruments and other accessories, was designed in this paper. A CMP (composite molecular pump) in parallel with TSP (titanium sublimation pump) as the main pump and a rotary-vane pump as the backing pump were designed in this system. After a CMP with displacement 2300l/s was chosen as the one of the main pumps, the total flow conductance between the outlet of vacuum chamber and the CMP was 1344l/s. The rough pump-down time was approximate 5 min by using a rotary-vane pump with pumping speeds 15l/s. In order to ensure the normal operation of the main pumps, a water chilling unit was designed in the system, which can achieve limiting vacuum of 5×10-6Pa in the vacuum chamber of 0.2 m3.
Databáze: OpenAIRE