A Practical Viscoplastic Damage Model for Lead-Free Solder
| Autor: | David M. Pierce, Paul T. Vianco, A. F. Fossum, M. K. Neilsen |
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| Rok vydání: | 2005 |
| Předmět: |
Work (thermodynamics)
Materials science Viscoplasticity business.industry Metallurgy Isotropy Structural engineering Microstructure Computer Science Applications Electronic Optical and Magnetic Materials Stress (mechanics) Creep Mechanics of Materials Soldering Electrical and Electronic Engineering business Reliability (statistics) |
| Zdroj: | Journal of Electronic Packaging. 128:71-81 |
| ISSN: | 1528-9044 1043-7398 |
| Popis: | This paper summarizes the results of a program to construct an internal variable viscoplastic damage model to characterize 95.5Sn–3.9Ag–0.6Cu (wt.%) lead-free solder under cyclic thermomechanical loading conditions. A unified model is enhanced to account for a deteriorating microstructure through the use of an isotropic damage evolution equation. Model predictions versus experimental data are given for constant strain-rate tests that were conducted at strain rates of 4.2×10−5s−1 and 8.3×10−4s−1 over a temperature range from −25°Cto160°C; cyclic shear tests; and elevated-temperature creep tests. A description is given of how this work supports larger ongoing efforts to develop a predictive capability in materials aging and reliability, and solder interconnect reliability. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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