The Role of Mass Transfer in the Rate of Electropolishing of Conical Copper Cavities under Natural Convection
| Autor: | G.H. Sedahmed, Y.O. Fouad, A. M. Ahmed, Mohamed Helmy Abdel-Aziz |
|---|---|
| Rok vydání: | 2021 |
| Předmět: |
Mass transfer coefficient
Materials science Natural convection 020209 energy Limiting current chemistry.chemical_element Thermodynamics 02 engineering and technology Surfaces and Interfaces 021001 nanoscience & nanotechnology Copper Industrial and Manufacturing Engineering Surfaces Coatings and Films Physics::Fluid Dynamics Electropolishing chemistry Mass transfer 0202 electrical engineering electronic engineering information engineering Physics::Accelerator Physics 0210 nano-technology Dissolution Dimensionless quantity |
| Zdroj: | Surface Engineering and Applied Electrochemistry. 57:217-221 |
| ISSN: | 1934-8002 1068-3755 |
| DOI: | 10.3103/s1068375521020034 |
| Popis: | Rates of mass transfer during electropolishing of conical copper cavities were studied by measuring the limiting current of anodic dissolution of copper in phosphoric acid. Parameters studied were physical properties of the solution and dimensions of the cavity. It was found that cavity dissolution takes place through a turbulent flow mechanism. The rate of polishing was expressed in terms of the mass transfer coefficient which was related to different variables by the following dimensionless correlation: Sh = 0.686(Sc × Gr)0.313. A comparison was made between the present results and those obtained earlier with other cavity geometries. |
| Databáze: | OpenAIRE |
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