S1310101 Development of Rotary Grinding Machine for 450mm Si Wafer : Positioning accuracy of wheel spindle which creates both rotary and axial feed motions

Autor: Jumpei Kusuyama, Alexander H. Slocum, Akinori Yui, Shintaro Iwahashi, Takayuki Kitajima, Hirotsugu Saito, Ayumu Honda
Rok vydání: 2015
Předmět:
Zdroj: The Proceedings of Mechanical Engineering Congress, Japan. 2015:S1310101
ISSN: 2424-2667
Databáze: OpenAIRE