Effect of CuZnAl particles addition on microstructure of Cu/Sn58Bi/Cu TLP bonding solder joints
| Autor: | Lei Sun, Lei Zhang, Long Weimin, Ming-yue Xiong, Peng He |
|---|---|
| Rok vydání: | 2019 |
| Předmět: |
010302 applied physics
Materials science Intermetallic Liquid phase 02 engineering and technology 021001 nanoscience & nanotechnology Condensed Matter Physics Microstructure 01 natural sciences Surfaces Coatings and Films Soldering 0103 physical sciences Composite material 0210 nano-technology Instrumentation |
| Zdroj: | Vacuum. 167:301-306 |
| ISSN: | 0042-207X |
| DOI: | 10.1016/j.vacuum.2019.06.024 |
| Popis: | In order to reduce the formation of voids in the Cu/Sn58Bi/Cu solder joints during transient liquid phase (TLP) bonding, the effect of CuZnAl particles on microstructure of Cu/SnBi/Cu TLP bonding solder joints was investigated. After bonding, the prism-type Cu6Sn5 intermetallic compounds (IMCs) were formed at the interface. The growth of Cu6Sn5 IMC grains was controlled by the interface reaction flux J2. The prism-type Cu3Sn IMCs grew at the expense of Cu6Sn5 IMCs. With the increase of bonding time, the solder joints were converted into all IMCs, indicating that SnBi solder and SnBi-0.5 CuZnAl solder are suitable for low-temperature bonding and high-temperature applications. When the CuZnAl particles were added, the growth of the interfacial IMCs was inhibited, and the formation of voids was significantly reduced. |
| Databáze: | OpenAIRE |
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