| Autor: |
Nachiket R. Raravikar, Amaneh Tasooji, Sandeep B. Sane, Ali Fallah-Adl, Ravi Mahajan, Richard J. Harries |
| Rok vydání: |
2011 |
| Předmět: |
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| Zdroj: |
International Symposium on Microelectronics. 2011:000223-000231 |
| ISSN: |
2380-4505 |
| Popis: |
The work presented here is one of the key elements of an integrated methodology for predicting reliability in packaging systems (IMPRPK) developed by Arizona State University (ASU) and Intel. IMPRPK approach is based on a probabilistic methodology, focusing on three major tasks: (1) Finite Element analysis (FEM) to predict loading conditions, (2) Characterization of BGA solder joints to identify failure mechanisms and obtain statistical data, and (3) development of a probabilistic methodology to achieve an integrated reliability solution. The focus of this paper is on FEM (task 1), evaluating the effect of package design/form-factor and solder materials on the extent of deformation (e.g., inelastic stress/strain and strain energy density) experienced by BGA solder joints. Global and Local FEM results for two different package designs (Flip-chip and wire-bonded FLI) and two different BGA solder materials (lead-free SAC405 and lead-rich eutectic Sn37Pb) are discussed. The FEM results and the applicability of the existing reliability models (e.g., energy-based model) to the complex microelectronics packaging systems are validated through independent comparison with the accelerated thermal cycled (ATC) test data. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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