| Autor: |
T. A. Lukashenko, A. N. Zubik, A. A. Evstrapov, A. I. Tsimbalov, A. L. Bulyanitsa |
| Rok vydání: |
2020 |
| Předmět: |
|
| Zdroj: |
Adhesives. Sealants. Technologia. :27-33 |
| ISSN: |
1813-7008 |
| DOI: |
10.31044/1813-7008-2020-0-12-27-33 |
| Popis: |
The solvents to be compatible with polymethylmethacrylate (PMMA) were selected on the basis of qualitative and quantitative criteria. The features of the solvent bonding connecting seam of the irreversible bonding PMMA of various trademarks have been studied. It is shown that the method of solvent bonding with vinylacetate can be an alternative to adhesive bonding when sealing microchips since the solvent bonding connecting seam makes a smaller contribution to the change in the working volume of microstructures. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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