Ultra Low-k Dielectric Films with Ultra Small Pores Using Poragens Chemically Bonded to Siloxane Resin

Autor:	Bianxiao Zhong, Eric S. Moyer
Rok vydání:	2004
Předmět:	chemistry.chemical_compound Materials science chemistry Siloxane Low-k dielectric Composite material
Zdroj:	ACS Symposium Series ISBN: 9780841238572 Polymers for Microelectronics and Nanoelectronics
DOI:	10.1021/bk-2004-0874.ch013
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::509c3cab6f9b17d260aedd7dc6dcc991 https://doi.org/10.1021/bk-2004-0874.ch013 Zobrazit plný text záznamu