CiB(Chip in Board) Optical Engine Module Using Advanced Fan-Out Package Technology
| Autor: | Jong Heon Kim, Sang Yong Park, Ji Ni Shim, Kwon Yongtae, Ju Hyun Nam, Chang Woo Lee, Nam Chul Kim, Jun Kyu Lee |
|---|---|
| Rok vydání: | 2019 |
| Předmět: |
SIMPLE (military communications protocol)
Computer science Process (computing) Fan-out 02 engineering and technology 021001 nanoscience & nanotechnology Chip 01 natural sciences Die (integrated circuit) 010309 optics 0103 physical sciences Electronic engineering Key (cryptography) Redistribution layer 0210 nano-technology |
| Zdroj: | 2019 IEEE 69th Electronic Components and Technology Conference (ECTC). |
| Popis: | In this paper, the development of a new optical chip in board (CiB) package adapting Fan-out technology that offers thermal, electrical and thin structure benefit was reported. Optical CiB package contain 4 optical die and is made smaller and thinner than market with the redistribution layer technology of FO-WLP. The key advantages such as high production yield, low cost and simple process steps surpass the conventional optical packages that depends on high precision alignment but always difficult to achieve good performance. Through finally demonstrated that communication is possible at the target speed of 10Gbps/Ch through actual measurement. In this paper describes the structural features of Embedded optical CiB package with integration of nepes'Fan-out technology. |
| Databáze: | OpenAIRE |
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