Additional grain boundary strengthening in length-scale architectured copper with ultrafine and coarse domains
| Autor: | Sebastian Krauß, Xiaodong Hou, Benoit Merle |
|---|---|
| Rok vydání: | 2019 |
| Předmět: |
010302 applied physics
Length scale Materials science Mechanical Engineering Metals and Alloys chemistry.chemical_element 02 engineering and technology 021001 nanoscience & nanotechnology Condensed Matter Physics Compression (physics) Microstructure 01 natural sciences Copper Grain size chemistry Mechanics of Materials 0103 physical sciences General Materials Science Composite material 0210 nano-technology Grain boundary strengthening |
| Zdroj: | Scripta Materialia. 165:55-59 |
| ISSN: | 1359-6462 |
| DOI: | 10.1016/j.scriptamat.2019.02.019 |
| Popis: | The strength of polycrystals is known to increase with decreasing grain size, known as Hall-Petch effect. However, this relationship fails to predict the strength of samples with a non-uniform distribution of grain sizes. In this study, we purposely designed and fabricated copper micropillars with a strongly bimodal microstructure: half volume consisted of a large number of ultrafine grains, while the other half was predominantly single-crystalline. Micropillar compression evidenced that bimodal samples are 35% stronger than their counterparts containing only ultrafine grains. This paradoxical finding highlights the greater strengthening potential of microstructure distribution engineering, compared to the traditional grain refinement strategy. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|
Full Text from ScienceDirect