Phase field simulation of healing and growth of voids in interconnects under electric field-induced interface migration

Autor:	Jiaming Zhang, Peizhen Huang
Rok vydání:	2022
Předmět:	Mechanics of Materials Mechanical Engineering General Physics and Astronomy General Materials Science
Zdroj:	European Journal of Mechanics - A/Solids. 94:104600
ISSN:	0997-7538
DOI:	10.1016/j.euromechsol.2022.104600
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::5016feab3a172f4a0007c9f5f6e70552 https://doi.org/10.1016/j.euromechsol.2022.104600 Zobrazit plný text záznamu Full Text from ScienceDirect