Intermetallic Compound Growth Induced by Electromigration in Sn-2.5Ag Solder Joints with ENEPIG Surface Finish
| Autor: | Jieun Yu, Sujong Kim, Won Sik Hong, Namhyun Kang |
|---|---|
| Rok vydání: | 2022 |
| Zdroj: | Journal of Welding and Joining. 40:225-232 |
| ISSN: | 2466-2100 2466-2232 |
| Popis: | The equation for predicting the growth behavior of intermetallic compounds (IMC) by electromigration (EM) of the Cu/ENEPIG/Sn-2.5Ag/Cu solder joint was modeled, and the actual behavior observed through experiments and the predicted behavior were compared. After reflow, (Cu, Ni)6Sn5 was formed near the ENEPIG/solder interface, and Cu6Sn5 was produced near the solder/Cu interface. Furthermore, Cu6Sn5 islands and Ag3Sn were formed with the β-Sn matrix in the solder. The mobility of Cu, Ni, and Sn atoms at the ENEPIG/IMC/solder interface was calculated to derive a thickness variation equation of the IMC with respect to the current application time. The modeling predicted that if the current density was maintained for 250 h at 10 kA/cm2, the IMC thickness increased by 4.2 ㎛. As a result of the EM experiment, the IMC at the ENEPIG/solder interface grew by 4.2 ㎛; this exactly matched the prediction. A comparison of the thickness of the IMC layer indicated that the OSP/solder interface produced approximately 9 ㎛, and the ENEPIG/solder interface grew by approximately 4.2 ㎛. Therefore, the Ni plating layer of the ENEPIG surface treatment prevented the diffusion of Cu and suppressed the growth of IMC by approximately 50 %. |
| Databáze: | OpenAIRE |
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