Eutectic-based wafer-level-packaging technique for piezoresistive MEMS accelerometers and bond characterization using molecular dynamics simulations
| Autor: | Yoshitada Isono, Ryoji Okada, T. Iwasaki, Takanori Aono, Atsushi Kazama |
|---|---|
| Rok vydání: | 2018 |
| Předmět: |
Microelectromechanical systems
Materials science business.industry Mechanical Engineering 010401 analytical chemistry 02 engineering and technology 021001 nanoscience & nanotechnology Accelerometer 01 natural sciences Piezoresistive effect 0104 chemical sciences Electronic Optical and Magnetic Materials Characterization (materials science) Molecular dynamics Mechanics of Materials Optoelectronics Electrical and Electronic Engineering 0210 nano-technology business Wafer-level packaging Eutectic system |
| Zdroj: | Journal of Micromechanics and Microengineering. 28:035004 |
| ISSN: | 1361-6439 0960-1317 |
| DOI: | 10.1088/1361-6439/aaa2d8 |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|