Thermal effects during the deposition of thin silver, gold and copper films and their influence on internal stress measurements
| Autor: | R. Abermann, R. Kramer, H. P. Martinz |
|---|---|
| Rok vydání: | 1980 |
| Předmět: |
Materials science
Metallurgy Metals and Alloys chemistry.chemical_element Surfaces and Interfaces Substrate (electronics) Radiation Evaporation (deposition) Copper Surfaces Coatings and Films Electronic Optical and Magnetic Materials Metal chemistry visual_art Thermal Materials Chemistry visual_art.visual_art_medium Deposition (phase transition) Composite material Internal stress |
| Zdroj: | Thin Solid Films. 70:127-137 |
| ISSN: | 0040-6090 |
| Popis: | The temperature changes of glass substrates were measured during the deposition of silver, gold and copper films. The measurements were carried out continuously and in situ throughout the evaporation process. In addition, the absorptivities of metal films of various thicknesses were determined for black-body radiation at 300 and 1300 K after deposition. The results that were obtained are used to calculate the variation of the substrate temperature during the evaporation of the metal. This in turn permits the correction of mechanical stress measurements for inherent thermal effects. |
| Databáze: | OpenAIRE |
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