Copper and silver sintered die-attach compared in HV-H3TRB and thermal shock cycling
| Autor: | Felix Steiner, Dai Ishikawa, Hideo Nakako, Thomas Blank |
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| Rok vydání: | 2023 |
| Zdroj: | 2023 International Conference on Electronics Packaging (ICEP). |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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