Warpage simulation and experimental verification for 320 mm × 320 mm panel level fan-out packaging based on die-first process
| Autor: | Tingyu Lin, Jun Li, Meiying Su, Liqiang Cao, Cheng Chen, Gengxin Tian, Chen Feng |
|---|---|
| Rok vydání: | 2018 |
| Předmět: |
010302 applied physics
business.product_category Packaging engineering business.industry Computer science Shell element Process (computing) Fan-out Mechanical engineering 020206 networking & telecommunications 02 engineering and technology Condensed Matter Physics 01 natural sciences Atomic and Molecular Physics and Optics Finite element method Surfaces Coatings and Films Electronic Optical and Magnetic Materials Software Consistency (statistics) 0103 physical sciences 0202 electrical engineering electronic engineering information engineering Die (manufacturing) Electrical and Electronic Engineering Safety Risk Reliability and Quality business |
| Zdroj: | Microelectronics Reliability. 83:29-38 |
| ISSN: | 0026-2714 |
| DOI: | 10.1016/j.microrel.2018.02.010 |
| Popis: | Warpage for 320 mm × 320 mm panel level fan-out packaging based on die-first process was investigated by both simulation and experimental approaches. In the present paper, a simple and efficient FEA (Finite Element Analysis) method based on shell element was introduced. Finite element models were built by using the software of Ansys products to predict and analysis the warpage for feasibility of large panel fan-out packaging technology in aspect of material, package geometries, package size, process conditions and metal density. In order to verify the accuracy and the precision of the simulation method, test vehicle with dies was fabricated by using low cost ‘die first (face down)’ fan-out technology. Warpage of the test vehicle was measured by using Shadow Moire method. The simulated warpage result and the experimental one exhibit good consistency. |
| Databáze: | OpenAIRE |
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