2-Dimensional Analysis of Plasma Ashing Damage Induced by Oxygen-Based Plasmas Along Nanopores in SiOCH Film for a Nanoscale Back-End of Line Process

Autor:	Hwan Jun Zang, Minwoo Ha, Sang-Soo Park, Sun Woo Kim, Hyun Yong Yu, Choon Hwan Kim, Gwang Sik Kim
Rok vydání:	2016
Předmět:	Materials science Biomedical Engineering chemistry.chemical_element Bioengineering Nanotechnology General Chemistry Plasma Condensed Matter Physics Oxygen Nanopore Back end of line chemistry Scientific method General Materials Science Plasma ashing Nanoscopic scale
Zdroj:	Journal of Nanoscience and Nanotechnology. 16:11766-11770
ISSN:	1533-4880
DOI:	10.1166/jnn.2016.13590
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::4f5cae692a9081751ab5e5df7ccd6d2c https://doi.org/10.1166/jnn.2016.13590 Zobrazit plný text záznamu