Enhanced mechanical, thermal and dielectric properties of polyimide nanocomposites containing SiCp (SiCw) nanofillers for high energy-storage applications

Autor: Zhao Xin Zhang, Shang Ke Yang, Jun Wei Shen, Jia Yang, Jun Bian, Ai Ping Zhang, Hai Lan Lin, Dai Qiang Chen
Rok vydání: 2022
Předmět:
Zdroj: Journal of Polymer Research. 29
ISSN: 1572-8935
1022-9760
DOI: 10.1007/s10965-022-03297-8
Databáze: OpenAIRE